Latest releasesBack to market feed

Attachments

European market disclosures, company announcements, and official source documents.

Terms Latest releasesEN

© 2026 Phynwire. All rights reserved.

Information service only. Not investment advice.

New last trading date for bond loan issued by Tempcon Group AB | Phynwire

Tempcon Group AB

New last trading date for bond loan issued by Tempcon Group AB

Original source on nasdaq.com

The following bond loan issued by Tempcon Group AB will have a new last trading date.

ISIN	SE0023971254
New last trading date	2029-03-28

For further information concerning this exchange notice please contact Issuer Surveillance, telephone +46 8 405 72 80, or iss@nasdaq.com. 